(1) Data checking;
(2) Manufacturing feasibility evaluating;
(3) Manufacturing Instruction (MI) preparing.
01
Engineering Preparation
Cut the Sheet of Copper-Clad Laminate (CCL) into the production panel according to actual manufacturing and utilization.
02
Cut Sheet
(1) Photo-imaging;
(2) Etching;
(3) Automatic Optical Inspection (AOI).
03
Conductive Patterns on Inner Layer Transferring
(1) Brown Oxide for conductive patterns on inner layers;
(2) Lay-up;
(3) Pressing.
04
Lamination
Electro-plate the copper on the surface of the board and wall of the hole to reach the thickness requested, and then coat the etch resist (Copper-Tin Protection) on the conductive patterns.
09
Pattern Plating
The copper which was not coated by etch resist will be removed by etching. After the etch resist (Copper-Tin protection) will be stripped, the copper circuits are formed. The conducting areas and connections are now properly established.
10
Etching
Scan the conductive patterns to determine the potential imperfections by comparing it with the original Gerber. All potential imperfections need to be verified or/and repaired.
11
AOI for Outer Layer
Coat mask over the bare copper except for mounting or/and testing.
(1) Silkscreen or Spraying;
(2) Exposure;
(3) Developing;
(4) Post-curing.
12
Solder Mask
Print the legends/characters for identifying components, test points, parts of the PCB, warning symbols, logos, and marks desired by the customer. This stands useful while customers' service and repair.
13
Legends Silk-Screen
Protecting the exposed copper circuitry and to provide a solder-able surface when assembling (soldering) the components to the printed circuit board.
14
Surface Finishing
Drill plated-through holes, non-plated through holes and slots.
05
Drilling
Metalize the holes by using the method of chemical depositing copper plating on the walls of the hole.
06
P.T.H
Increase and strengthen the copper plating on walls of holes by the method of electro-plating after the P.T.H process.
07
Panel Plating
Photo-imaging desired layout on copper clad laminates.
08
Conductive Patterns on Outer Layer Transferring
Profile the production panel by routing, scoring, and beveling, etc. to get the customer's panel with the outline sizes desired.
15
Profiling
100% Electrical test is done using probe testers. Open and short circuit tests are performed to ensure functional reliability.
16
Electrical Test
100% Automatic Visual Inspection is done to examine any defect on the board appearance using a computerized system.
17
First Stop
All PCBs would be vacuum-packed with silica gel and humidity indicator.
18