01
Engineering Preparation
(1) Data checking;
(2) Manufacturing feasibility evaluating;
(3) Manufacturing Instruction (MI) preparing.
03
Conductive Patterns on
02
Cut Sheet
Cut the Sheet of Copper-Clad Laminate (CCL) into the production panel according to actual manufacturing and utilization.
04
Lamination
Inner Layer Transferring
(1) Photo-imaging;
(2) Etching;
(3) Automatic Optical Inspection (AOI).
(1) Brown Oxide for conductive patterns on inner layers;
(2) Lay-up;
(3) Pressing.
05
Drilling
Drill plated-through holes, non-plated through holes and slots.
07
Panel Plating
06
P.T.H
Metalize the holes by using the method of chemical depositing copper plating on the walls of the hole.
08
Conductive Patterns on
Outer Layer Transferring
Increase and strengthen the copper plating on walls of holes by the method of electro-plating after the P.T.H process.
Photo-imaging desired layout on copper clad laminates.
09
Pattern Plating
Electro-plate the copper on the surface of the board and wall of the hole to reach the thickness requested, and then coat the etch resist (Copper-Tin Protection) on the conductive patterns.
11
AOI for Outer Layer
Scan the conductive patterns to determine the potential imperfections by comparing it with the original Gerber. All potential imperfections need to be verified or/and repaired.
13
Legends Silk-Screen
Print the legends/characters for identifying components, test points, parts of the PCB, warning symbols, logos, and marks desired by the customer. This stands useful while customers' service and repair.
10
Etching
The copper which was not coated by etch resist will be removed by etching. After the etch resist (Copper-Tin protection) will be stripped, the copper circuits are formed. The conducting areas and connections are now properly established.
12
Solder Mask
Coat mask over the bare copper except for mounting or/and testing.
(1) Silkscreen or Spraying;
(2) Exposure;
(3) Developing;
(4) Post-curing.
14
Surface Finishing
Protecting the exposed copper circuitry and to provide a solder-able surface when assembling (soldering) the components to the printed circuit board.
15
Profiling
Profile the production panel by routing, scoring, and beveling, etc. to get the customer's panel with the outline sizes desired.
17
FQC
Inspect imperfections on PCBs.
19
Packaging
16
Electrical Test
100% Electrical test is done using probe testers. Open and short circuit tests are performed to ensure functional reliability.
18
FQA
Sampling the boards passing FQC in accordance with C=0 AQL 0.65.
All PCBs would be vacuum-packed.